Call For Contributions

presentation or poster.

Important Dates

   
Submission Deadline: April 19, 2024
Acceptance Notification: May 6, 2024
Final Version Due: July 15, 2024
Conference Dates: August 25-27, 2024

Areas of Interest

  • General-Purpose Processor Chips
    • High-Performance, Low-Power
    • Multi-Core and Highly-Reliable Systems
  • Domain-Specific Chips
    • AI Accelerators
    • Graphics Chips
    • Machine Learning Chips
    • Data Analytics and Big Data Processing
    • IoT and Always-On Functions
    • Custom Chips for Emerging Applications
  • Reconfigurable Chips
    • FPGAs and FPGA-Based Systems
    • Coarse-Grained Reconfigurable Arrays
  • Security
    • Secure Hardware
    • Hardware Support for Software Security
  • Mobile and Embedded Devices
    • Graphics/Multimedia/Gaming
    • SoC, Security, and DSP Chips
  • Communications and Networking
    • Wireless LAN/WAN/PAN
    • Network and I/O Processors
  • Emerging Computing Architectures
    • Neuromorphic
    • Quantum Computing
    • Analog Computing, Photonic Chips
  • Memory Technologies
    • Emerging Memory
    • Packaging, 3D, Stacked
  • Other Enabling Technologies
    • Power and Thermal Management
    • Sustainable Computing
    • Generative Tools
    • Packaging and Testing
    • Display Technologies
    • On-Chip Optics & Sensors
    • Novel Computing Technologies
  • Software and Systems for Emerging Hardware
    • Programming Models, Runtime Systems
    • Performance, Power, Debug, and Evaluation

Submission Guidelines

Submissions must consist of the following:

  • “Presentation” or “Poster”
  • Title
  • Extended abstract (two pages maximum)
  • Presenter’s contact information (name, affiliation, job title, address, phone(s), and email)
  • Indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal.
  • Indication if you would like the submission to be held confidential.

Evaluation Criteria

Regular presentation and poster submissions are evaluated by the Program Committee on the basis of: performance of the device(s), degree of innovation, use of advanced technology, potential market significance and anticipated interest to the audience. Both regular presentation slides and posters are published in the Hot Chips proceedings.

Presentation Guidelines

Presentations at Hot Chips are in the form of 30-minute talks using PowerPoint or PDF. Presentation slides will be published in the Hot Chips Proceedings. Participants are not required to submit written papers, but selected papers will be invited to submit a paper for inclusion in a special issue of IEEE Micro.

Poster Guidelines

Poster submissions are also accepted from both industry and academia and consist of 4 slides with a one-page summary. In particular, student posters describing applied research performed at a university are encouraged. Program related questions/comments?

Contact

Please email our Program Committee Co-Chairs at program@hotchips.org. (For general inquiries, email chair@hotchips.org)